SHENZHEN GOLDLINK TONGDA ELECTRONICS CO. LTD., Shenzhen, China

Exhibitor of the 18th International Exhibition Composite-Expo 2026

April 22 - 24, 2026 / Hall 13, Pavilion 3, IEC Crocus-Expo, Moscow, Russia

Exhibitor information:

Goldlink Tongda Electronics Co.,Ltd is committed to the design, development and manutacture of Thermal Interface Materials. Developing high-quality thermal interface materials (TIMs) and thermal countermeasure solutions is our top priority. Our excellent R & D team can provide customers thermal countermeasure solutions is our top priority. Our excellent R & D team can provide customers with efficient and reliable thermal management solutions to meet the needs of customers in the face of increasingly advanced products.

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